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The Clean Room will include standard deposition tools (multi-target PVD for metal deposition [two tools], PECVD for oxide and semiconductor deposition), reactive ion etching (metal and oxide), planarization (CMP tools), thin film characterization tools (thickness monitor, spectral ellipsometer), ion miller, RTA and ovens, and other equipment required for small scale prototype and device fabrication on wafer sizes not exceeding 4”.

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